Advanced manufacturing

Built with precision, at speed and scale

From prototype development and process engineering to volume production and test, our vertically integrated manufacturing capability enables customers to move confidently from TRL 4-9 with the quality, traceability and resilience required for mission-critical applications.

From concept to production

Filtronic brings together engineering, manufacturing and quality assurance within an integrated production environment, enabling customers to accelerate development, reduce programme risk and achieve consistent, repeatable performance at scale.

Our facilities have been developed specifically for high-frequency RF and microwave technologies, supporting complex assemblies where precision, quality and reliability are fundamental to success. 


Built for high-performance RF

Precision manufacturing

Purpose-built facilities engineered for high-frequency RF, microwave and mmWave technologies.

Vertical integration

Engineering, process, manufacturing testing and quality assurance working together under one roof.

Mission-ready quality

Advanced process control, full traceability and rigorous quality systems supporting critical applications.

Scalable production

Supporting programmes from early prototypes through to volume manufacture with repeatable, consistent quality.

Hybrid microelectronics manufacturing

Advanced assembly for complex RF systems

Filtronic specialises in hybrid microelectronics manufacturing, combining automated assembly, precision processes and specialist RF expertise to deliver complex microwave and mmWave subsystems. Our highly automated manufacturing capability supports customers developing products where precision, repeatability and performance are essential. 


Capabilities:

+ Automated die attach 
+ Precision wire and ribbon bonding 
+ Hermetic sealing 
+ Hybrid assembly 
+ Microwave and mmWave packaging 

Advanced semiconductor packaging and OSAT

Secure packaging for high-performance devices

Packaging is critical to overall RF performance. Filtronic provides advanced Outsourced Semiconductor Assembly and Test (OSAT) capability, integrating semiconductor packaging, assembly and test into a secure manufacturing environment designed for demanding commercial, aerospace and defence applications.
 

Capabilities:

+ Semiconductor packaging 
+ Plastic and hermetic packaging 
+ Lead-frame technologies 
+ RF package optimisation 
+ Environmental qualification 

Manufacturing engineering and process development

Optimising products for production

Exceptional manufacturing begins long before production starts. Filtronic’s manufacturing and process engineering teams work alongside customers to improve manufacturability, increase yield, reduce risk and optimise products for long-term production.

Whether supporting a new product introduction or scaling an existing design, we help customers achieve greater efficiency and reliability throughout the manufacturing lifecycle. 

Capabilities:

+ Process engineering 
+ Yield improvement 
+ Design for manufacture 
+ Thermal optimisation 
+ Production transfer 

RF test and validation

Confidence built into every subsystem

Every subsystem is verified through comprehensive in-house testing to ensure consistent performance against demanding operational requirements.
From RF and microwave characterisation to environmental screening and production validation, our testing capability provides confidence before systems enter service.
 
Capabilities:

+ RF & microwave testing 
+ Environmental screening 
+ Automated production test 
+ Qualification support 
+ Performance validation 

Facilities built for the future

  • Advanced UK and US manufacturing facilities
  • Automated hybrid microelectronics production
  • ISO cleanrooms and engineering laboratories
  • Secure RF assembly and packaging
  • In-house RF and environmental testing 
  • Prototype to volume production 
  • Full process traceability 
  • Global supply chain capability 


More than a manufacturing partner

Filtronic works alongside customers from initial concept through to production, combining RF engineering expertise with advanced manufacturing capability to solve complex technical challenges.



Our collaborative approach enables faster development, reduced programme risk and manufacturing solutions that are engineered for long-term performance, quality and supply chain resilience.

Engineering confidence from design to deployment

Talk to our experts